Micro- and Nanofabrication Cleanroom Shared Facility

key capabilities

results as of 2024

wafer diameter up to 150 mm

“Silicon-on-insulator”, “Silicon Nitride” and “Lithium Niobate” platforms

critical dimensions from 65 nm

active optical edge coupling and with diffraction elements

packaging

electro-optical characterization

process design kit (PDK) based on Russian-made software

planned production volume in MPW (multi-project wafer) format up to 600 10x10 mm chips per year

potential for technology transfer to experimental PIC production facilities being created in the Russian Federation

contacts

Skolkovo Institute of Science and Technology

The Territory of the Skolkovo Innovation Center

Russia, Moscow, 121205, Bolshoy Boulevard, 30, bld.1